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Samsung is gearing up to begin mass production of 3D NAND memory with 290 layers by the end of this month, as reported by The Korea Economic Daily. The South Korean tech giant is also aiming to introduce 3D NAND memory with 430 layers by the year 2025.
The Korea Economic Daily notes that this development pertains to Samsung's ninth generation 3D NAND memory. If these reports are accurate, it would mean that Samsung's V9 NAND memory features ten additional layers compared to the previously reported 280 layers mentioned earlier this year, resulting in different specifications. Samsung has not revealed many specifics about the V9 NAND memory as of now. However, it has been confirmed that the bit density of this ninth generation memory will be more than 80 percent higher than that of the V7 NAND memory. The availability date for the first SSDs with this V9 NAND memory remains unknown at this time.
The Korea Economic Daily also mentions Samsung's plans to roll out its tenth generation of 3D NAND memory in 2025. This upcoming memory is expected to have 430 layers and will utilize a triple stacking technique that involves combining three nand stacks instead of two. While the source of this information is cited as analyst firm TechInsights, Samsung has yet to officially confirm these rumors. In a previous report from DigiTimes in the summer of 2023, it was also mentioned that Samsung was targeting the release of 430-layer nand memory.
Typically, a higher number of layers translates to increased capacity per memory chip, enabling the production of SSDs with larger storage capacities. Additionally, production costs per terabyte generally decrease as the number of layers rises.
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