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AMD has unveiled the new Ryzen Embedded 8000 SoCs, a series of four chipsets built on the AMD XDA architecture. These SoCs feature a Zen4 CPU, RDNA 3 GPU, and a dedicated NPU for AI tasks, delivering a total of 16 TOPs of computing power.
The Ryzen Embedded 8000 lineup consists of four models: the 8845HS, 8645HS, 8840U, and 8640U. According to AMD, all these chipsets are fabricated on a 4nm architecture from TSMC and are based on the Zen 4 architecture. Depending on the variant, the CPUs feature six or eight computing cores with twelve or sixteen threads, respectively.
Each AMD Ryzen Embedded 8000 CPU is equipped with 16MB of L3 cache memory. The GPUs in these chipsets are based on the RDNA 3 architecture and support four to six work group processors (WGPs) depending on the model. The new processors also support DDR5-5600 memory modules and feature twenty PCIe 4.0 lanes.
Furthermore, every processor in the Ryzen Embedded 8000 series comes with an NPU boasting 16 TOPs of computing power. This NPU aims to enhance the efficiency of AI tasks without overloading the CPU or GPU. AMD also provides open-source libraries and an SDK for efficient NPU control.
The AMD Ryzen Embedded 8000 chips offer support for two USB 4 connections with DP Alt mode and Type C connector, along with a single USB 3.2 Gen2 connection at 10Gbit/s with Type C connector and DP Alt mode, and another USB 3.2 Gen 2 connection at 10Gbit/s, likely with a Type A connector. Additionally, AMD includes four USB 2.0 connections.
In its press release, AMD highlights the chips' suitability for the business sector. The Ryzen Embedded 8000 chips are designed to be scalable in various applications and offer support for up to ten years, making them ideal for long-term projects.
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